Press Release

In this report, the Covid-19 Impact on Semiconductor Assembly Process Equipment market is valued at USD XX million in 2019 and is expected to reach USD XX million by the end of 2026, growing at a CAGR of XX% between 2019 and 2026. Covid-19 Impact on Semiconductor Assembly Process Equipment market has been broken down by major regions, with complete market estimates on the basis of products/applications on a regional basis.

Browse full research report at https://www.crystalmarketreport.com/covid-19-impact-on-semiconductor-assembly-process-equipment-market-global-research-reports-2020-2021

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Semiconductor Assembly Process Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.

The increase in application of semiconductor ICs across many segments has increased the demand for Semiconductor Assembly Process Equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.

This report provides a complete quantitative data and qualitative analysis on the global market for Semiconductor Assembly Process Equipment. Market size is analysed by country, product type, application, and competitors. Expanded coverage includes additional end-user industry breakdowns and in-depth producer profiles.

Prior to COVID-19, the global market for Semiconductor Assembly Process Equipment was anticipated to grow from US$ XX million in 2020 to US$ XX million by 2026; it is expected to grow at a CAGR of xx% during 2021–2026, whereas post-COVID-19 scenario, the market for Semiconductor Assembly Process Equipment is projected to grow from US$ XX million in 2020 (a change by ~XX% compared to market estimated for 2020 before the outbreak of COVID-19) to US$ XX billion by 2026; it is expected to grow at a CAGR of XX% during 2021–2026.

This report covers market size and forecasts of Semiconductor Assembly Process Equipment, including the following market information:

Global Semiconductor Assembly Process Equipment Market Size, 2019-2021, and 2020 (quarterly data), (US$ Million) & (Unit)

Global Semiconductor Assembly Process Equipment Market Size by Type and by Application, 2019-2021, and 2020 (quarterly data), (US$ Million) & (Unit)

Global Semiconductor Assembly Process Equipment Market Size by Region (and Key Countries), 2019-2021, and 2020 (quarterly data), (US$ Million) & (Unit)

Global Semiconductor Assembly Process Equipment Market Size by Company, 2019- 2020 (quarterly data), (US$ Million) & (Unit)

Key market players

Major competitors identified in this market include ASM Pacific Technology, Kulicke & Soffa Industries, Besi, Accrutech, Shinkawa, Palomar Technologies, Hesse Mechatronics, Toray Engineering, West Bond, HYBOND, DIAS Automation, etc.

Based on the Region:

Asia-Pacific (China, Japan, South Korea, India and ASEAN)

North America (US and Canada)

Europe (Germany, France, UK and Italy)

Rest of World (Latin America, Middle East & Africa)

Based on the Type:

Die Bonders

Wire Bonders

Packaging Equipment

Others

Based on the Application:

IDMs

OSAT

Browse full research report at https://www.crystalmarketreport.com/covid-19-impact-on-semiconductor-assembly-process-equipment-market-global-research-reports-2020-2021

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This post was originally published on The Picayune Current